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SMIC, Huawei, imec, and Qualcomm in Joint Investment on SMIC's new R&D company
2015/06/24 21:03
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中國半導體製造技術是落後台積、聯電
但是還會落後多久



SMIC, Huawei, imec, and Qualcomm in Joint Investment on SMIC's New Research and Development Company
A Joint Collaboration is Set Up to Build China's Most Advanced Integrated Circuit Research and Development Platform.
SHANGHAI, June 23, 2015 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI; SEHK: 981), China's largest and most advanced semiconductor foundry; Huawei, a leading global information and communications technology (ICT) solutions provider; imec, one of the world-leading nanoelectronics research and development (R&D) centers; and Qualcomm Global Trading Pte. Ltd., an affiliate of Qualcomm Incorporated, one of the world's largest fabless semiconductor vendors, held a signing ceremony at the Great Hall of the People, to announce the formation of SMIC Advanced Technology Research & Development (Shanghai) Corporation, an equity joint venture company. The joint venture company will focus on R&D towards next generation CMOS logic technology and build China's most advanced integrated circuit (IC) development R&D platform.
His Majesty (H.M.) King Philippe of Belgium is visiting China in the framework of several cooperation agreements between China and Belgium related to cutting-edge technology. A Chinese leader and H.M. King Philippe of Belgium witnessed the signing ceremony of the joint investment.
SMIC Advanced Technology R&D (Shanghai) Corporation will be majority owned by SMIC, while Huawei, imec, and Qualcomm will be minority shareholders. The current focus will be on developing 14nm logic technology. Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC will be the legal representative, Dr. Yu Shaofeng, Vice President of SMIC will be the general manager.
This project is a major breakthrough in the cooperation model for IC manufacturers, international trade companies and research institutions. This project will facilitate closer cooperation between upstream and downstream companies, leading-edge R&D, and other synergies in the industry's global eco-system. With the joint venture company oriented on innovation, it can target the demands of the industry more quickly and effectively through its R&D and manufacturing resources. Meanwhile, by enabling fabless semiconductor companies to join the development process as shareholders, the product development cycle can be shortened and the advanced process node tape out time can be accelerated.
In the first phase, the joint venture company will develop 14 nanometer CMOS technology for mass production, which will be based on imec's state-of-the-art knowhow in advanced semiconductor processing technology. The new R&D project will be done at SMIC's production line.
SMIC will have the rights to license the required intellectual property rights on the mass production technologies of advanced nodes developed by the joint venture company, enabling these technologies to be applied to SMIC's current and future range of products and serve SMIC's business with other companies. This can improve the overall level of China's IC technologies, and is expected to facilitate the mass production of 16/14nm ICs in China by 2020, which is one of the goals set by the National IC Industry Development Outline. In the future, companies in China's IC manufacturing industry, universities and colleges, and research institutions will continue working together on this platform to further enhance the core competitiveness of the industry.
Dr. Zhou Zixue, Chairman, of SMIC; Steve Chu, Vice President of Huawei; Ludo Deferm, Executive Vice President of Corporate Business and Public Affairs of imec; and Derek Aberle, President of Qualcomm Incorporated were all present at the signing ceremony.
"This is the most advanced work for China's IC industry," said Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director, of SMIC, "With 15 years of experience in manufacturing and R&D, SMIC is China's largest semiconductor enterprise and has the capabilities to bring 14nm technology into production. It is exciting to be working with the largest IC design company both in China and abroad, and the world's top research institutes to tackle advanced IC process technology. This collaboration will play an important role in improving our technologies and products. The new company model has allowed us to explore a new path to open up R&D and manufacturing resources in this industry's ecosystem, and develop our advanced technology and R&D capabilities. In addition, it actively promotes the collaboration across all parts of the eco-system in China. "
Steve Chu, Vice President of Huawei said: "Huawei has always been open to win-win partnerships. With our 20 years of experience in the IC design field and collaboration from our global partners, we are keen to promote the development of research capabilities in IC technology, to create China's most advanced IC R&D platform. We believe that this collaboration will consolidate the IC domain, increase its resources and capabilities, and thereby improving the overall level of China's IC industry. The improvements will provide more benefits to operators, companies, customers and partners."
Luc Van den hove, CEO and president of imec, added: "We see a growing potential in China, both as a market and as a source of innovative engineering. The expertise of the four partners is focused on the creation of an excellent platform to foster nanoelectronics R&D in China. And the joint development of a 14nm process facility will be a step stone to achieve this goal. A step stone that, I am convinced, will benefit the world's IC manufacturing community."
"We are pleased to collaborate with SMIC, Huawei and imec to establish this new technology R&D joint venture company," said Derek Aberle, president of Qualcomm Incorporated. "This is a significant milestone for the Chinese and global IC industries, which reinforces Qualcomm's commitment to the continued growth of the vibrant semiconductor ecosystem in China. We believe that this venture will serve to better meet the growing needs of local Chinese and global customers who demand high performance, low power mobile devices. The collaboration will also help bring even more advanced processing technology and wafer manufacturing capacity to China, thereby helping China to build capability in FinFET technology. "
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2015/06/25 09:59
大勢所趨

習近平同比利時國王菲利普會談

2015年06月24日08:54  

  本報北京6月23日電 (記者李偉紅)國家主席習近平23日在人民大會堂同比利時國王菲利普舉行會談。兩國元首高度評價中比關系發展,同意繼續共同努力,鞏固兩國政治互信,打造務實合作新增長點,深化民間友好,推動中比關系好上加好。

  習近平指出,近年來,中比關系發展勢頭喜人,正處於歷史最好時期。兩國建立了全方位友好合作伙伴關系,在貿易、投資、科技、教育、文化、衛生、港口、通信、旅游、司法協助、糧食安全等領域合作順利推進。中方高度重視中比關系,視比利時為歐盟內重要合作伙伴,願同比方保持密切高層交往和高水平政治互信,牢牢把握中比關系全方位友好大方向。當前,中國正在實施創新驅動發展戰略,雙方可以在創新領域找准利益契合點,在高端制造業、生物制藥、環境科技、可持續發展等領域開展廣泛合作。中國政府支持有實力的中國企業到比利時投資興業,也歡迎更多比利時企業把中國作為“第二本土市場”。雙方可以在中比產業投資基金基礎上,進一步構建融資新模式,加大對高技術、成長型企業扶持。雙方要發揮海陸空全方位互聯互通優勢,推進中歐、亞歐物流產業發展和跨境電子商務合作。中方支持中國西部同安特衛普鐵路互聯互通,希望比方支持中國企業參與歐洲戰略投資計劃和泛歐鐵路網建設。兩國政府要加強政策協調和規劃,為促進雙方人文交流創造更多有利條件。中方鼓勵兩國擴大互派教師和留學生規模,希望比方積極支持中歐人員往來便利化。明年將是中比建交45周年,中方願同比方一道,舉辦好慶祝活動,讓中比友好深入人心。

  習近平指出,今年是中歐建交40周年。中歐雙方全面戰略伙伴關系不斷深化拓展,已經成為全球最重要雙邊關系之一。中歐要繼續推進中歐四大伙伴關系“落地生根”,維護以聯合國為核心的國際體系,積極研究對接各自發展戰略,加大在實施結構性改革等方面交流力度,加強文明間對話,探索和諧共處之道。比利時是歐盟創始成員國和總部所在地,中方希望比方一如既往在中歐關系發展中發揮積極推動作用。

  習近平向菲利普介紹了中方的“一帶一路”倡議,指出中方贊賞比方參與亞洲基礎設施建設的積極意願,歡迎比利時參與“一帶一路”倡議,支持亞洲基礎設施投資銀行優先考慮吸收比利時加入。

  菲利普表示,我作為比利時國王,首次國事訪問就選擇了中國,表明著比方對比中關系的高度重視。中國發展取得的成就和為應對挑戰作出的努力令比方印象深刻。比利時贊賞中方的“一帶一路”倡議,作為中國在歐洲可靠的伙伴,願利用自身優勢,成為中國進入歐洲的橋梁。比方將繼續積極致力於加強同中國在經貿、創新、教育、生物技術、衛生醫療、社保等領域合作。

  菲利普表示,比利時作為歐盟總部所在地,在歐洲事務中發揮著重要作用。比方感謝中方支持歐洲一體化進程和歐元區建設,願推動歐洲投資計劃同中國“一帶一路”倡議對接。

  兩國元首還就應對氣候變化、非洲大湖地區局勢等雙方共同關心的問題交換了意見。

  會談后,兩國元首共同見証了航天、海關、科技、地方合作、核燃料、教育等領域雙邊合作文件的簽署。

  會談前,習近平在人民大會堂東門外廣場為菲利普舉行歡迎儀式。習近平主席夫人彭麗媛、國務院副總理馬凱、全國人大常委會副委員長陳竺、全國政協副主席齊續春等出席。

  《 人民日報 》( 2015年06月24日 01 版)

tanifa2015/06/25 10:14回覆